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 MF70
MF70
Fast Recovery Diode Advance Information
Replaces March 1998 version, DS4195-2.1 DS1955-3.0 January 2000
APPLICATIONS
s Inverse Parallel Or Series Connected Diode s Power Supplies s High Frequency Applications
KEY PARAMETERS VRRM 1600V IF(AV) 70A IFSM 700A Qr 26C trr 915ns
FEATURES
s Glass Passivation s Fast Recovery Characteristics s High Voltage Capabilities
VOLTAGE RATINGS
Type Number Repetitive Peak Reverse Voltage VRRM V 1600 1400 1200 Conditions
MF70-1600 MF70-1400 MF70-1200
VRSM = VRRM + 100V
Lower voltage grades available. For stud anode add suffix 'R' to type number.
Outline type code: DO5. See Package Details for further information.
CURRENT RATINGS
Symbol IF(AV) IF(RMS) IF Parameter Mean forward current RMS value Continuous (direct) forward current Conditions Half wave resistive load, Tcase = 75oC Tcase = 75oC Tcase = 75oC Max. 70 110 90 Units A A A
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MF70
SURGE RATINGS
Symbol IFSM I2t Parameter Surge (non-repetitive) forward current I2t for fusing Conditions 10ms half sine; with 100% VRRM, Tj = 125oC 10ms half sine; Tj = 125oC Max. 700 2450 Units A A2s
THERMAL AND MECHANICAL DATA
Symbol Rth(j-c) Rth(c-h) Parameter Thermal resistance - junction to case Thermal resistance - case to heatsink dc Mounting torque 3.5Nm with mounting compound Forward (conducting) Tvj Virtual junction temperature Reverse (blocking) Tstg Storage temperature range Mounting torque Use torque wrench -55 3.2 125 125 3.8
o
Conditions
Min. -
Max. 0.37 0.2 125
Units
o
C/W
o
C/W
o
C C
C Nm
CHARACTERISTICS
Symbol VFM IRM trr Qr trr VTO rT VFRM Forward voltage Peak reverse current Reverse recovery time Recovered charge Reverse recovery time Threshold voltage Slope resistance Forward recovery voltage Parameter Conditions At 210A peak, Tcase = 25oC At VRRM, Tcase = 100oC IF = 1A, diRR/dt = 25A/s Tcase = 25oC, VR = 100V IF = 100A, diRR/dt = 100A/s Tcase = 25oC, VR = 100V At Tvj = 125oC At Tvj = 125oC di/dt = 1000A/s, Tj = 125oC Typ. 80 Max. 2.0 10 300 26 915 1.3 3.34 Units V mA
ns
C ns V m V
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MF70
CURVES
500
Measured under pulse conditions
80
400
Instantaneous forward current - (A)
Tcase = 25C
Transient forward voltage - (V)
60
95%
300
40 5%
200
20
100
Tj = 125C Tj = 25C
0
0
0
200 400 600 800 1000 1200 Rate of rise of forward current - (A/s)
0
1.0 2.0 3.0 Instantaneous forward voltage - (V)
Fig.2 Forward recovery voltage vs rate of rise of forward voltage
Fig.1 Maximum (limit) forward characteristics
0.5
Thermal impedance - C/W
0.4 d.c. 0.3
0.2
0.1
0 0.001
0.01
0.1 Time - (s)
1.0
10
Fig.3 Maximum transient thermal impedance - junction to case
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MF70
1.05 1.0
Recovery time - (s)
Tcase = 125C
0.9 0.8 0.7 0.6 0.55 IF = 100A 95% IF = 50A IF = 100A 5% IF = 50A 1 10 100 Rate of rise of reverse current - (A/s)
Fig.4 Recovery time vs dIR/dt
1000
40 IF = 100A T = 125C 36 case 95% 32 IF = 50A 28 IF = 100A 24 5% 20 IF = 50A 16 12 8 4 0 1 10 100 Rate of change of reverse current - (A/s)
Fig.5 Recovered charge vs dIR/dt
Recovered charge - (C)
1000
5000
Tcase = 55
Peak current - (A)
1000
10
50 00
00
25
00
10
00 500 300
10 50H 0 z
0
100 10
100 1000 Pulse width - (s)
Fig.6 Frequency curves - square waveform
10000
4/8
MF70
500
Tcase = 85
Peak current - (A)
100
10 00 0 50 00 25 00 10 00 50 0 30 0
50 10 Hz 0
10 10
100 1000 Pulse width - (s)
Fig.7 Frequency curves - square waveform
10000
500
Peak current - (A)
100
2.0J 1.0 0.5 0.2 0.1
10 10
100 1000 Pulse width - (s)
Fig.8 Energy per pulse - square waveform
10000
5000
Tcase = 55
Peak current - (A)
1000
10 00 50 0 00 25 00 10 3 00 500 00 10 0 50 Hz
100 10
100 1000 Pulse width - (s)
Fig.9 Frequency curves - sine waveform
10000
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MF70
5000
Tcase = 85
Peak current - (A)
1000
10 50 00 0 00 25 00 10 00 50 30 00 10 0 50 Hz
100 10
100 1000 Pulse width - (s)
Fig.10 Frequency curves - sine waveform
10000
500
Peak current - (A)
2.0J 100 1.0 0.5 0.2 0.1 20 10
100 1000 Pulse width - (s)
Fig.11 Energy per pulse - sine waveform
10000
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MF70 PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
Hex. 17.35mm AF max
O4.0
23
11.5
Thread 1/4 in 28 UNF 2A Weight: 20g
ASSOCIATED PUBLICATIONS
Title Calculating the junction temperature or power semiconductors Thyristor and diode measurement with a multi-meter Use of V , r on-state characteristic
TO T
Application Note Number AN4506 AN4853 AN5001
7/8
MF70
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs).
HEATSINKS
Power Assembly has it's own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2000 Publication No. DS4195-3 Issue No. 3.0 January 2000 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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